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CD14538BMS
November 1994
CMOS Dual Precision Monostable Multivibrator
Description
CD14538BMS dual precision monostable multivibrator provides stable retriggerable/resettable one-shot operation for any fixed-voltage timing application. An external resistor (RX) and an external capacitor (CX) control the timing and accuracy for the circuit. Adjustment of RX and CX provides a wide range of output pulse widths from the Q and Q terminals. The time delay from trigger input to output transition (trigger propagation delay) and the time delay from reset input to output transition (reset propagation delay) are independent of RX and CX. Precision control of output pulse widths is achieved through linear CMOS techniques. Leading-edge-triggering (+TR) and trailing-edge-triggering (-TR) inputs are provided for triggering from either edge of an input pulse. An unused +TR input should be tied to VSS. An unused -TR input should be tied to VDD. A RESET (on low level) is provided for immediate termination of the output pulse or to prevent output pulses when power is turned on. An unused RESET input should be tied to VDD. However, if an entire section of the CD14538BMS is not used, its inputs must be tied to either VDD or VSS. See Table 1. In normal operation the circuit retriggers (extends the output pulse one period) on the application of each new trigger pulse. For operation in the non-retriggerable mode, Q is connected to -TR when leading-edge triggering (+TR) is used or Q is connected to +TR when trailing-edge triggering (-TR) is used. The time period (T) for this multivibrator can be calculated by: T = RXCX. The minimum value of external resistance, RX is 4K. The minimum and maximum values of external capacitance, CX, are 0pF and 100F, respectively. The CD14538BMS is interchangeable with type MC14538 and is similar to and pin-compatible with the CD4098B* and CD4538B**.
* T = 0.5 RXCX for CX 1000pF. * T = RXCX; CX min = 5000pF.
Features
* High-Voltage Type (20V Rating) * Retriggerable/Resettable Capability * Trigger and Reset Propagation Delays Independent of RX, CX * Triggering From Leading or Trailing Edge * Q and Q Buffered Outputs Available * Separate Resets * Wide Range of Output-Pulse Widths * Schmitt-Trigger Input Allows Unlimited Rise and Fall Times On +TR and -TR Inputs * 100% Tested For Maximum Quiescent Current at 20V * Maximum Input Current of 1A at 18V Over Full Package-Temperature Range: - 100nA at 18V and +25oC * Noise Margin (Full Package-Temperature Range): - 1V at VDD = 5V - 2V at VDD = 10V - 2.5V at VDD = 15V * 5V, 10V and 15V Parametric Ratings * Standardized Symmetrical Output Characteristics * Meets All Requirements of JEDEC Tentative Standards No. 13B, "Standard Specifications for Description of "B" Series CMOS Device's
Applications
* Pulse Delay and Timing * Pulse Shaping
The CD14538BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4X Frit Seal DIP H1L Ceramic Flatpack H6W
Pinout
CD14538BMS TOP VIEW
Functional Diagram
CX1 1 CX1 RXCX (1) 1 2 16 VDD 15 CX2 14 RXCX (2) 13 RESET (2) 12 +TR (2) 11 -TR (2) 10 Q2 9 Q2 VDD = 16 VSS = 8 15 14 RXCX(2) VDD CX2 RX2 +TR 12 -TR 11 RESET 13 MONO2 9 Q2 10 Q2 +TR 4 -TR 5 RESET 3 MONO1 2 RX1 VDD RXCX(1) 6 Q1
RESET (1) 3 +TR (1) 4 -TR (1) 5 Q1 6 Q1 7 VSS 8
7 Q1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
File Number
3192
7-640
Specifications CD14538BMS
Absolute Maximum Ratings
DC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . . -0.5V to +20V (Voltage Referenced to VSS Terminals) Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VDD +0.5V DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .10mA Operating Temperature Range . . . . . . . . . . . . . . . . -55oC to +125oC Package Types D, F, K, H Storage Temperature Range (TSTG) . . . . . . . . . . . -65oC to +150oC Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . +265oC At Distance 1/16 1/32 Inch (1.59mm 0.79mm) from case for 10s Maximum
Reliability Information
Thermal Resistance . . . . . . . . . . . . . . . . ja jc Ceramic DIP and FRIT Package . . . . . 80oC/W 20oC/W Flatpack Package . . . . . . . . . . . . . . . . 70oC/W 20oC/W o Maximum Package Power Dissipation (PD) at +125 C For TA = -55oC to +100oC (Package Type D, F, K) . . . . . . 500mW For TA = +100oC to +125oC (Package Type D, F, K) . . . . . Derate Linearity at 12mW/oC to 200mW Device Dissipation per Output Transistor . . . . . . . . . . . . . . . 100mW For TA = Full Package Temperature Range (All Package Types) Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS GROUP A SUBGROUPS 1 2 VDD = 18V, VIN = VDD or GND Input Leakage Current IIL VIN = VDD or GND VDD = 20 3 1 2 VDD = 18V Input Leakage Current IIH VIN = VDD or GND VDD = 20 3 1 2 VDD = 18V Output Voltage Output Voltage Output Current (Sink) Output Current (Sink) Output Current (Sink) Output Current (Source) Output Current (Source) Output Current (Source) Output Current (Source) N Threshold Voltage P Threshold Voltage Functional VOL15 VOH15 IOL5 IOL10 IOL15 IOH5A IOH5B IOH10 IOH15 VNTH VPTH F VDD = 15V, No Load VDD = 15V, No Load (Note 3) VDD = 5V, VOUT = 0.4V VDD = 10V, VOUT = 0.5V VDD = 15V, VOUT = 1.5V VDD = 5V, VOUT = 4.6V VDD = 5V, VOUT = 2.5V VDD = 10V, VOUT = 9.5V VDD = 15V, VOUT = 13.5V VDD = 10V, ISS = -10A VSS = 0V, IDD = 10A VDD = 2.8V, VIN = VDD or GND VDD = 20V, VIN = VDD or GND VDD = 18V, VIN = VDD or GND VDD = 3V, VIN = VDD or GND Input Voltage Low (Note 2) Input Voltage High (Note 2) Input Voltage Low (Note 2) Input Voltage High (Note 2) VIL VIH VIL VIH VDD = 5V, VOH > 4.5V, VOL < 0.5V VDD = 5V, VOH > 4.5V, VOL < 0.5V VDD = 15V, VOH > 13.5V, VOL < 1.5V VDD = 15V, VOH > 13.5V, VOL < 1.5V 3 1, 2, 3 1, 2, 3 1 1 1 1 1 1 1 1 1 7 7 8A 8B 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 LIMITS TEMPERATURE +25 C +125oC -55 C +25 C +125oC -55oC +25oC +125oC -55oC +25oC, +125oC, -55oC
o o o
PARAMETER Supply Current
SYMBOL IDD
CONDITIONS (NOTE 1) VDD = 20V, VIN = VDD or GND
MIN -100 -1000 -100 -
MAX 10 1000 10 100 1000 100 50 -0.53 -1.8 -1.4 -3.5 -0.7 2.8
UNITS A A A nA nA nA nA nA nA mV V mA mA mA mA mA mA mA V V V
+25oC, +125oC, -55oC 14.95 +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +25oC +125oC -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC 3.5 11 0.53 1.4 3.5 -2.8 0.7
VOH > VOL < VDD/2 VDD/2
1.5 4 -
V V V V
NOTES: 1. All voltages referenced to device GND, 100% testing being implemented. 2. Go/No Go test with limits applied to inputs
3. For accuracy, voltage is measured differentially to VDD. Limit is 0.050V max.
7-641
Specifications CD14538BMS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS GROUP A SUBGROUPS TEMPERATURE 9 10, 11 VDD = 5V, VIN = VDD or GND 9 10, 11 VDD = 5V, VIN = VDD or GND 9 10, 11 +25oC +125oC, -55oC LIMITS MIN MAX 600 810 500 675 200 270 UNITS ns ns ns ns ns ns
PARAMETER Propagation Delay +TR or -TR to Q or Q Propagation Delay Reset to Q or Q Transition Time
SYMBOL TPHL1 TPLH1 TPHL2 TPLH2 TTHL TTLH
CONDITIONS (Note 1, 2) VDD = 5V, VIN = VDD or GND
+25oC +125oC, -55oC
+25oC +125oC, -55oC
NOTES: 1. CL = 50pF, RL = 200K, Input TR, TF < 20ns. 2. -55oC and +125oC limits guaranteed, 100% testing being implemented. TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER Supply Current SYMBOL IDD CONDITIONS VDD = 5V, VIN = VDD or GND NOTES 1, 2 TEMPERATURE -55oC, +25oC +125oC VDD = 10V, VIN = VDD or GND 1, 2 -55 C, +25 C +125oC VDD = 15V, VIN = VDD or GND 1, 2 -55oC, +25oC
oC o o
MIN 4.95 9.95 0.36 0.64 0.9 1.6 2.4 4.2 +7
MAX 5 150 10 300 10 600 50 50 -0.36 -0.64 -1.15 -2.0 -0.9 -1.6 -2.4 -4.2 3 -
UNITS A A A A A A mV mV V V mA mA mA mA mA mA mA mA mA mA mA mA mA mA V V
+125 Output Voltage Output Voltage Output Voltage Output Voltage Output Current (Sink) VOL VOL VOH VOH IOL5 VDD = 5V, No Load VDD = 10V, No Load VDD = 5V, No Load VDD = 10V, No Load VDD = 5V, VOUT = 0.4V 1, 2 1, 2 1, 2 1, 2 1, 2
+25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC +125oC -55oC +125oC -55oC +125oC -55oC +125oC -55oC +125oC -55oC +125oC -55oC +125oC -55oC +25oC, +125oC, -55oC +25oC, +125oC, -55oC
Output Current (Sink)
IOL10
VDD = 10V, VOUT = 0.5V
1, 2
Output Current (Sink)
IOL15
VDD = 15V, VOUT = 1.5V
1, 2
Output Current (Source)
IOH5A
VDD = 5V, VOUT = 4.6V
1, 2
Output Current (Source)
IOH5B
VDD = 5V, VOUT = 2.5V
1, 2
Output Current (Source)
IOH10
VDD = 10V, VOUT = 9.5V
1, 2
Output Current (Source)
IOH15
VDD =15V, VOUT = 13.5V
1, 2
Input Voltage Low Input Voltage High
VIL1 VIH
VDD = 10V, VOH > 9V, VOL < 1V VDD = 10V, VOH > 9V, VOL < 1V
1, 2 1, 2
7-642
Specifications CD14538BMS
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) LIMITS PARAMETER Propagation Delay +TR OR -TR to Q or Q Propagation Delay Reset to Q or Q Transition Time SYMBOL TPHL1 TPLH1 TPHL2 TPLH2 TTHL TTLH TW CONDITIONS VDD = 10V VDD = 15V VDD = 10V VDD = 15V VDD = 10V VDD = 15V VDD = 5V VDD = 10V VDD = 15V Output Pulse Width CX = 0.1F RX = 100K Output Pulse Width CX = 10F RX = 100K Minimum Retrigger Time TW VDD = 10V VDD = 15V TW VDD = 5V VDD = 10V VDD = 15V TRR VDD = 5V VDD = 10V VDD = 15V Minimum Input Pulse Width +TR, -TR, or Reset Input Capacitance NOTES: 1. All voltages referenced to device GND. 2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized on initial design release and upon design changes which would affect these characteristics. 3. CL = 50pF, RL = 200K, Input TR, TF < 20ns. TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS LIMITS PARAMETER Supply Current N Threshold Voltage N Threshold Voltage Delta P Threshold Voltage P Threshold Voltage Delta Functional SYMBOL IDD VNTH VNTH VPTH VPTH F CONDITIONS VDD = 20V, VIN = VDD or GND VDD = 10V, ISS = -10A VDD = 10V, ISS = -10A VSS = 0V, IDD = 10A VSS = 0V, IDD = 10A VDD = 18V, VIN = VDD or GND VDD = 3V, VIN = VDD or GND Propagation Delay Time TPHL TPLH VDD = 5V 1, 2, 3, 4 +25oC NOTES 1, 4 1, 4 1, 4 1, 4 1, 4 1 TEMPERATURE +25oC +25oC +25oC +25oC +25oC +25oC MIN -2.8 0.2 VOH > VDD/2 MAX 25 -0.2 1 2.8 1 VOL < VDD/2 1.35 x +25oC Limit UNITS A V V V V V TW VDD = 5V VDD = 10V VDD = 15V CIN Any Input NOTES 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2 TEMPERATURE +25oC +25 C +25oC +25 C +25
oC o o
MIN 0 0 0 -
MAX 300 220 250 190 100 80 230 232 234 10.5 10.6 10.6 1.06 1.06 1.07 140 80 60 7.5
UNITS ns ns ns ns ns ns s s s ms ms ms s s s ns ns ns ns ns ns pF
+25oC +25 C +25 C +25oC +25oC +25oC +25 C +25 C +25oC +25oC +25
oC o o o o
Output Pulse Width Q or Q CX =.002F, RX = 100K
+25oC +25 C +25
oC o
+25oC +25
oC
+25oC
ns
NOTES: 1. All voltages referenced to device GND. 2. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
3. See Table 2 for +25oC limit. 4. Read and Record
7-643
Specifications CD14538BMS
TABLE 5. BURN-IN AND LIFE TEST DELTA PARAMETERS +25OC PARAMETER Supply Current - MSI-2 Output Current (Sink) Output Current (Source) SYMBOL IDD IOL5 IOH5A 1.0A 20% x Pre-Test Reading 20% x Pre-Test Reading DELTA LIMIT
TABLE 6. APPLICABLE SUBGROUPS CONFORMANCE GROUP Initial Test (Pre Burn-In) Interim Test 1 (Post Burn-In) Interim Test 2 (Post Burn-In) PDA (Note 1) Interim Test 3 (Post Burn-In) PDA (Note 1) Final Test Group A Group B Subgroup B-5 Subgroup B-6 Group D MIL-STD-883 METHOD 100% 5004 100% 5004 100% 5004 100% 5004 100% 5004 100% 5004 100% 5004 Sample 5005 Sample 5005 Sample 5005 Sample 5005 GROUP A SUBGROUPS 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9, Deltas 1, 7, 9 1, 7, 9, Deltas 2, 3, 8A, 8B, 10, 11 1, 2, 3, 7, 8A, 8B, 9, 10, 11 1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas 1, 7, 9 1, 2, 3, 8A, 8B, 9 Subgroups 1, 2 3 Subgroups 1, 2, 3, 9, 10, 11 IDD, IOL5, IOH5A, RONDEL10 READ AND RECORD IDD, IOL5, IOH5A IDD, IOL5, IOH5A IDD, IOL5, IOH5A
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
TABLE 7. TOTAL DOSE IRRADIATION MIL-STD-883 METHOD 5005 TEST PRE-IRRAD 1, 7, 9 POST-IRRAD Table 4 READ AND RECORD PRE-IRRAD 1, 9 POST-IRRAD Table 4
CONFORMANCE GROUPS Group E Subgroup 2
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS OSCILLATOR FUNCTION Static Burn-In 1 (Note 1) Static Burn-In 2 (Note 1) Dynamic BurnIn (Note 1) Irradiation (Note 2) NOTE: 1. Each pin except VDD and GND will have a series resistor of 10K 5%, VDD = 18V 0.5V 2. Each pin except VDD and GND will have a series resistor of 47K 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures, VDD = 10V 0.5V OPEN 6, 7, 9, 10 6, 7, 9, 10 2, 6, 7, 9, 10, 14 GROUND 1, 3 - 5, 8, 11 - 13, 15 1, 8, 15 1, 4, 8, 12, 15 1, 8, 15 VDD 2, 14, 16 2 - 5, 11 - 13, 14, 16 2, 14, 16 3 - 5, 11 - 13, 16 6, 7, 9, 10 5, 11 3, 13 9V -0.5V 50kHz 25kHz
7-644
Specifications CD14538BMS
TABLE 9. FUNCTIONAL TERMINAL CONNECTIONS VDD TO TERM # FUNCTION Leading-Edge Trigger/ Retriggerable Leading-Edge Trigger/ Non-Retriggerable Trailing-Edge Trigger/ Retriggerable Trailing-Edge Trigger/ Non-Retriggerable NOTE: 1. A triggerable one-shot multivibrator has an output pulse width which is extended one full time period (T) after application of the last trigger pulse. 2. A non-triggerable one-shot multivibrator has a time period (T) referenced from the application of the first trigger pulse.
INPUT PULSE TRAIN RETRIGGERABLE MODE PULSE WIDTH (+TR MODE)
VSS TO TERM # MONO1 MONO2
INPUT PULSE TO TERM # MONO1 4 4 MONO2 12 12 11 11
OTHER CONNECTIONS MONO1 MONO2
MONO1 3, 5 3 3 3
MONO2 11, 13 13 13 13
5-7
11 - 9
4
12
5 5
4-6
12 - 10
T
NON-RETRIGGERABLE MODE PULSE WIDTH (+TR MODE) T
Power-Down Mode
During a rapid power-down condition, as would occur with a power-supply short circuit or with a poorly filtered power supply, the energy stored in CX could discharge into Pin 2 or 14. To avoid possible device damage in this mode, when CX is 0.5 microfarad, a protection diode with a 1-ampere or higher rating (1N5395 or equivalent) and a separate ground return for CX should be provided as shown in Figure 1. An alternate protection method is shown in Figure 2, where a 51-ohm current-limiting resistor is inserted in series with CX. Note that a small pulse width decrease will occur however, and RX must be appropriately increases to obtain the originally desired pulse width.
IN5395 OR EQUIVALENT RX 2(14) + CX 0.5fd
VDD
16
1(15) VSS
8 VSS
FIGURE 1. RAPID POWER-DOWN PROTECTION CIRCUIT VDD
RX
2(14)
16
51 OHMS + CX 0.5fd
1(15)
8 VSS
FIGURE 2. ALTERNATE RAPID POWER-DOWN PROTECTION CIRCUIT
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
645
CD14538BMS Logic Diagram
16
VDD VDD RX 2(14) CX 1(15) VSS 8 VSS VDD HIGH Z VSS VDD Q 6 (10) VSS VDD 4(12) D R1 R2 Q FF CL Q CL R1 VDD CL R2 VCC = CL CL p VSS VSS n CL FF DETAIL p n Q CL R1 R2 CL p n CL *ALL INPUTS ARE PROTECTED BY CMOS PROTECTION NETWORK VSS Q VDD R4 VDD VDD VDD COMP I
+ -
R2
R3
+ R1
COMP II
7 (9) Q
*
R
3(13)
*
TR
*
TR
5(11)
FIGURE 3. 1/2 OF DEVICE SHOWN
Typical Performance Characteristics
OUTPUT LOW (SINK) CURRENT (IOL) (mA) OUTPUT LOW (SINK) CURRENT (IOL) (mA) AMBIENT TEMPERATURE (TA) = +25oC AMBIENT TEMPERATURE (TA) = +25oC
30 25 20 15 10 5
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
15.0 GATE-TO-SOURCE VOLTAGE (VGS) = 15V 12.5 10.0 7.5 5.0 2.5 10V
10V
5V 0 5 10 15
5V 0 5 10 15 DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
FIGURE 4. TYPICAL OUTPUT LOW (SINK) CURRENT CHARACTERISTICS
FIGURE 5. MINIMUM OUTPUT LOW (SINK) CURRENT CHARACTERISTICS
7-646
CD14538BMS Typical Performance Characteristics
DRAIN-TO-SOURCE VOLTAGE (VDS) (V) -15 -10 -5 AMBIENT TEMPERATURE (TA) = +25oC GATE-TO-SOURCE VOLTAGE (VGS) = -5V 0
(Continued)
DRAIN-TO-SOURCE VOLTAGE (VDS) (V) -15 -10 -5 OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA) AMBIENT TEMPERATURE (TA) = +25oC GATE-TO-SOURCE VOLTAGE (VGS) = -5V -5
0 -5 -10 -15
0
0 OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
-10V
-20 -25
-10V
-10
-15V
-30
-15V
-15
FIGURE 6. TYPICAL OUTPUT HIGH (SOURCE) CURRENT CHARACTERISTICS
+TR, -TR PROPAGATION DELAY TIME (tPHL, tPLH) -ns AMBIENT TEMPERATURE (TA) = +25oC
FIGURE 7. MINIMUM OUTPUT HIGH (SOURCE) CURRENT CHARACTERISTICS
RESETPROPAGATION DELAY TIME (tPHL, tPLH) -ns AMBIENT TEMPERATURE (TA) = +25oC
400
SUPPLY VOLTAGE (VDD) = 5V
400 SUPPLY VOLTAGE (VDD) = 5V
300
300
200
200
10V 15V
10V 15V
100
100
0
20
40 60 80 100 LOAD CAPACITANCE (CL) pF
0
20
40 60 80 100 LOAD CAPACITANCE (CL) pF
FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A FUNCTION OF LOAD CAPACITANCE (+TR OR -TR TO Q OR Q)
AMBIENT TEMPERATURE (TA) = +25oC TRANSITION TIME (tTHL, tTLH) (ns)
FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A FUNCTION OF LOAD CAPACITANCE (RESET TO Q OR Q)
PULSE WIDTH VARIATION - PERCENT NORMALIZED TO VDD = 10V AMBIENT TEMPERATURE (TA) = +25oC 3 2 1 0 -1 -2 -3
200 SUPPLY VOLTAGE (VDD) = 5V
150
100 10V 50 15V
0 0
20
40 60 80 100 LOAD CAPACITANCE (CL) (pF)
4
6
8 10 12 14 16 18 VDD SUPPLY VOLTAGE (VOLTS)
20
FIGURE 10. TYPICAL TRANSITION TIME AS A FUNCTION OF LOAD CAPACITANCE
FIGURE 11. TYPICAL PULSE-WIDTH VARIATION AS A FUNCTION OF SUPPLY VOLTAGE
7-647
CD14538BMS Typical Performance Characteristics
TYPICAL PULSE WIDTH VARIATION - PERCENT NORMALIZED TO VDD = 10V, TA = 25oC
(Continued)
TYPICAL PULSE WIDTH VARIATION - PERCENT NORMALIZED TO VDD = 10V, TA = 25oC
3 2 1 10V 0 5V -1 -2 -3 SUPPLY VOLTAGE (VDD) = 15V
3 2 1 0 -1 -2 -3 5V SUPPLY VOLTAGE (VDD) = 5V
10V
-60
-40
-20
0
20
40
60
80
100
120 140
-60
-40
-20
0
20
40
60
80
100
120 140
AMBIENT TEMPERATURE (oC)
AMBIENT TEMPERATURE (oC)
FIGURE 12. TYPICAL PULSE-WIDTH VARIATION AS A FUNCTION OF TEMPERATURE (RX = 100 K, CX = 0.1F)
6 4 2 8 1000 6 4 2
FIGURE 13. TYPICAL PULSE-WIDTH VARIATION AS A FUNCTION OF TEMPERATURE (RX = 100 K, CX = 2000pF)
8 6 4 2
TOTAL SUPPLY CURRENT (A)
IDD CURRENT (A) 50% DC
CL = 50pF, RL = 200K RX = 100K AMBIENT TEMPERATURE (TA) =25oC ONE MONOSTABLE OPERATING
RX = 100K TA = +25oC
1000
8 6 4 2
SUPPLY VOLTAGE (VDD) = 15V
100 8
6 4 2
10V 15V 18V SUPPLY VOLTAGE (VDD) = 5V
10 8
6 4 2 18 6 4 2 6 4 2
100
8 6 4 2
10V
10
8 6 4 2
5V
0.1 8
0.01
2 4 68
0
2 4 68 2 4 68 2 4 68 2 4 68 2 4 68 2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
0.0001
0.001
0.01 0.1 1 OUTPUT DUTY CYCLE (%)
10
100
10
100
1000
10K
100K
CX CAPACITANCE (pfs)
FIGURE 14. TYPICAL TOTAL SUPPLY CURRENT AS A FUNCTION OF OUTPUT DUTY CYCLE
FIGURE 15. TYPICAL TOTAL SUPPLY CURRENT AS A FUNCTION OF LOAD CAPACITANCE
Chip Dimension and Pad Layout
METALLIZATION: Thickness: 11kA - 14kA, PASSIVATION: 10.4kA - 15.6kA, Silane
AL.
BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches
Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch)
7-648

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